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Laser Micro Milling

Laser micro milling can be used to selectively remove material from a wide variety of substrates, to form a wide range of blind features from pockets and channels to chamfers and many other 2.5D structures.

Not only can the volumetric removal rate of these features be controlled with the correct choice of laser, but through various processing strategies, very accurate control of the features surface roughness can be obtained.

Laser Milling Specification
Minimum width of cut
Typically 5µm
Maximum Material Thickness
Typically 1mm (dependent upon speed requirements)
Most materials from soft plastics to hard ceramics including transparent materials

Research Literature

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