T-Series Trimmer
State-of-the-art, wafer-level tool to trim analogue integrated circuit (IC) devices with optimised precision optics and beam positioning for repeatable control of the laser trimming process.
Precision and Speed
Oxford Lasers has developed an advanced precise and fast laser tool for active trimming of wafer-level analogue IC devices. The T-Series Trimmer, in combination with common semiconductor industry testers and probers, enables faster and more accurate trimming of thin-film resistors to deliver advanced, high-value devices.
- Improved laser beam control for higher accuracy
- 10 mm x 10 mm scan area with sub-micron positioning accuracy
- Adjustable laser pulse frequency capability within each trim for faster trimming no change in bite size
- Microscope quality in-line imaging with digital zoom with no loss of alignment
Vision and laser alignment over the full 10 mm x 10 mm trimming area allow for fast and accurate alignment using either single-die or multi-die alignment strategies. Combined with the ability to adjust trimming speed while retaining positional accuracy, the T-Series Trimmer provides significantly faster throughput without compromising performance.
Software Control
The T-Series Trimmer is built on nearly 50 years of laser processing experience at Oxford Lasers, including experience with advanced architectures that ensure the fastest control of the tool. Direct real-time communications of all the key systems functions within the Adjust™ control platform drives process throughput; this includes communication protocols that alert the test cell to stop the laser pulsing (after any individual pulse) once the desired device performance is achieved.
T-Series Trimmer
The 1342 nm laser spot size can be adjusted in the 6 μm to 10 μm range to match the trimming requirements. Pulse energy is controlled for all pulses and repetition rates.
- Advanced laser beam control gives repeatable trims per pulse
- Bite size control down to 0.1 μm for highest accuracy of trims
- Accuracy of trim to < 1 μm over the full laser scan area
- Metrology to guarantee performance of 24/7 operation
Specification | Value |
|---|---|
Laser Class |
Laser Class 1 interlocks to prober |
Laser Wavelength |
1342 nm: other wavelengths possible |
Laser Spot Size |
6 μm to 10 μm: Adjustable at tool set up, larger spot size possible |
Pulse Length |
30 ns to 35 ns |
Pulse Energy |
0.1 μJ to 2.0 μJ: Software controlled |
Laser Trimming Repetition Rate |
200 Hz to > 10 KHz: Software controlled |
Laser Bite Size |
0.1 μm to 10 μm |
Laser Scan Area |
10 mm x 10 mm |
Positional Accuracy of Laser Spot |
+/- 1.2 μm at +/- 3 sigma: over full laser scan area |
Visual System Resolution |
< 1 μm |
Vision Field of View |
0.1 mm to 3.0 mm |
Dimensions |
814 mm x 983 mm x 404 mm |
Weight |
150 kg |
Power |
220 VAC +/- 20%, 50/60 Hz, 16A current rating Type C |
Compressed Air |
414 kPa filtered |
Standards |
NFPA 79, UL 61010-1, SEMI S2/S8 |
Compatible Probers |
Industry Standard 300 mm and 200 mm probers |
Trimmer to Tester Output Signals (TTL) |
Pulse Issued, Pulse Issued Warning, End of Travel, Trimmer Ready/Busy |
Tester to Trimmer Input Signals (TTL) |
Feature Start/Pause, Next Leg, variable pulse rate within a trim, Single Laser Blast |
Software Tester Command Suite |
ASCII Ethernet (> 60 commands for controlling and interrogating the trimmer. |
