Guide Plate Laser Drilling for Semiconductor Wafer Test
Oxford Lasers specializes in ultra-high precision drilling of guide plates for semiconductor wafer test.
Guide plates are a component of vertical probe cards and consist of thousands of micro holes through which the probes are fitted to ensure accurate location of each probe.
Precision is a key factor in the production of fine pitch guide plates. Oxford Lasers excels at ultra-precision laser drilling of guide plates to produce tighter tolerances, smaller features with smaller corner radii.
Technological advances in semiconductor manufacturing are placing demands on suppliers of test equipment. The number of test points are increasing while the size and separation of the test pads are decreasing. Oxford Lasers keeps in step with industry advances by laser drilling guide plates with an increasingly tighter pitch, smaller hole sizes and various shapes without sacrificing a very high positional accuracy.
Different hole shapes such as round, elliptical, square, rectangular (as commonly used for MEMS probes) and asymmetrical can be achieved over a range of materials from ceramics to polymers and more.
Machine Learning for Productivity Benefits
Unique in the industry, Oxford Lasers have built a machine-learning system that provides a closed feedback loop in the manufacturing of guide plates. From initial design through to measurement of positional accuracy we have shown that with the use of AI we can enhance productivity and performance each time a plate is produced.
Ultra-High Precision Laser Drilling Capabilities
- Tight pitch: <5 µm web
- Hole size: <20 µm
- Corner radii: <3 µm
- Higher hole count >100,000 holes
- Range of shapes: square, round, elliptical, rectangular, asymmetrical
- Range of materials: hard ceramics, machinable ceramics, polymers, etc.
- Hole positional accuracy: 1 µm
Expertise and Innovation
Oxford Lasers have been producing guide plates for market leaders in the probe card industry for decades. Our experience and knowledge have resulted in cutting edge developments to support the advancement in electronics testing and manufacturing innovation.
Unparalleled in the industry, Oxford Lasers has expertise in laser technologies including applying machine learning into our production process for enhanced performance and pinpoint accuracy. Our experienced team with extensive knowledge in advanced laser micromachining techniques enables Oxford Lasers to produce ultra-high precision features and products for our global customer base.
If you would like more information or to request a quote, please contact us today.