Laser Micromachining Systems
A Series
Compact Laser Micromachining Tool



- Compact Platform: Small footprint, free standing system
- Stability: Granite frame with vibration isolation
- Reliability: Diode pumped solid state laser (DPSS)
- Functionality: Cimita software
Capable and compact, the A Series platform delivers impressive laser micromachining, capable of integrating nano or femtosecond pulsed lasers.
The most compact platform in the Oxford Lasers portfolio, the A Series was designed as a turnkey laser micromachining tool. Used primarily for process development and R&D, the A Series with its compact design is also suitable for small production applications. The A Series is typically used for process development, prototyping and pilot production but can be modified for numerous applications.
Please contact us for more information on the range of options and accessories available for the A Series.
A Series Specifications
Category | Specification |
---|---|
Laser Type |
Nanosecond or Femtosecond |
Wavelength Options |
355nm/ 532nm/ 1064nm |
Dimensions (mm) |
1470 W x 1500 D x 1950 H mm (Extractor: 300 W x 300 D x 460 H mm) |
Product Weight (kg) |
up to 1500kg (dependent on laser type and options) |
Engineering the translaminar fracture behaviour of thin-ply composites
Application: Microrobotics. https://doi.org/10.1016/j.compscitech.2016.06.002
Damage-Tolerant Nacre-Inspired Cfrp
Application: Microrobotics. https://doi.org/10.1016/j.jmps.2018.04.004
Rapid, In-Situ Plasma Functionalization of Carbon Nanotubes for Improved CNT/Epoxy Composites
Application: Carbon Nanotubes. doi.org/10.1039/C6RA23103A
Flexible Micro-Supercapacitor Based on Graphene with 3D Structure
doi.org/10.1002/smll.201603114
Flexible Low-Voltage Carbon Nanotube Heaters and their Applications
Application: Carbon Nanotubes. doi.org/10.5772/64054 (external link, opens new window)
Bio-Inspired Microstructure Design To Improve Translaminar Fracture Toughness Of Thin-Ply Composites
Application. Microrobotics. ICCM Conference Paper (external link, opens new window)
Laser Systems Comparison Table
Product | Description | Laser Type | Wavelength Options | Dimensions (W x D in mm) | Weight |
---|---|---|---|---|---|
A Series |
Compact turnkey laser system for R&D and Production |
nanosecond or femtosecond |
355nm/532nm/1064nm |
1470 x 1500 x 1950 |
up to 1500kg |
C Series |
High throughput production system |
nanosecond, picosecond or femtosecond |
355nm/532nm/1064nm |
2800 x 1700 x 2040 |
up to 2700kg |
J Series |
Largest, high-powered system with multiwavelength option |
up to any two of: nanosecond, picosecond or femtosecond |
Up to any two of: 355nm/532nm/1064nm |
Dependent on final laser type and options |
Dependent on final laser type and options |
ProbeDrill |
Preconfigured system for semiconductor guide plate probe card drilling |
Diode pumped solid state (DPSS) |
355nm/532nm/1064nm |
2800 x 1700 x 2040 |
2600kg |
SamplePrep Tool |
Preconfigured system for preparing micro samples for X-ray microscopy (XRM) |
Diode pumped solid state (DPSS) |
355nm/532nm/1064nm |
1470 x 1200 x 1950 |
1200kg |